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71V25761S166BGI
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71V25761S166BGI

Basic Information Overview

  • Category: Integrated Circuit (IC)
  • Use: Memory chip
  • Characteristics: High-speed, low-power, non-volatile
  • Package: BGA (Ball Grid Array)
  • Essence: Non-volatile memory storage
  • Packaging/Quantity: Bulk packaging, typically sold in reels or trays

Specifications

  • Memory Type: SRAM (Static Random Access Memory)
  • Capacity: 256K x 16 bits
  • Operating Voltage: 3.3V
  • Access Time: 10 ns
  • Operating Temperature Range: -40°C to +85°C
  • Data Retention: More than 20 years

Detailed Pin Configuration

The 71V25761S166BGI IC has a total of 48 pins. The pin configuration is as follows:

  1. VCC
  2. A0
  3. A1
  4. A2
  5. A3
  6. A4
  7. A5
  8. A6
  9. A7
  10. A8
  11. A9
  12. A10
  13. A11
  14. A12
  15. A13
  16. A14
  17. A15
  18. OE#
  19. WE#
  20. CE#
  21. UB#
  22. LB#
  23. I/O0
  24. I/O1
  25. I/O2
  26. I/O3
  27. I/O4
  28. I/O5
  29. I/O6
  30. I/O7
  31. I/O8
  32. I/O9
  33. I/O10
  34. I/O11
  35. I/O12
  36. I/O13
  37. I/O14
  38. I/O15
  39. NC
  40. GND
  41. VCCQ
  42. NC
  43. NC
  44. NC
  45. NC
  46. NC
  47. NC
  48. NC

Functional Features

  • High-speed operation allows for quick data access and retrieval.
  • Low-power consumption makes it suitable for battery-powered devices.
  • Non-volatile memory retains data even when power is removed.
  • BGA package provides a compact and reliable form factor.

Advantages

  • Fast access time enables efficient data processing.
  • Low power consumption prolongs battery life in portable devices.
  • Non-volatile memory ensures data integrity during power cycles.
  • BGA packaging offers improved thermal performance and reliability.

Disadvantages

  • Limited storage capacity compared to other memory technologies.
  • Higher cost per bit compared to some alternative memory solutions.
  • Sensitive to electrostatic discharge (ESD) and requires proper handling.

Working Principles

The 71V25761S166BGI is based on SRAM technology, which uses flip-flops to store each bit of data. It operates by storing data in a static state, eliminating the need for constant refreshing like dynamic RAM (DRAM). The chip utilizes a combination of address lines and control signals to read from or write to specific memory locations.

Detailed Application Field Plans

The 71V25761S166BGI is commonly used in various applications, including: - Embedded systems - Networking equipment - Telecommunications devices - Industrial automation - Consumer electronics

Detailed and Complete Alternative Models

Some alternative models that offer similar functionality to the 71V25761S166BGI include: - CY62157EV30LL-45ZSXI by Cypress Semiconductor - IS62WV25616BLL-55TLI by ISSI - AS6C62256-55PCN by Alliance Memory

These alternative models provide comparable specifications and can be considered as substitutes for the 71V25761S166BGI in different applications.

Note: The content provided above is a sample and may not reflect actual product details. Please refer to the manufacturer's datasheet for accurate information.

技術ソリューションにおける 71V25761S166BGI の適用に関連する 10 件の一般的な質問と回答をリストします。

Sure! Here are 10 common questions and answers related to the application of 71V25761S166BGI in technical solutions:

  1. Q: What is the 71V25761S166BGI? A: The 71V25761S166BGI is a specific model of memory chip used in technical solutions.

  2. Q: What is the capacity of the 71V25761S166BGI? A: The 71V25761S166BGI has a capacity of 256 megabits (32 megabytes).

  3. Q: What is the operating voltage range for this memory chip? A: The operating voltage range for the 71V25761S166BGI is typically between 2.7V and 3.6V.

  4. Q: What is the maximum clock frequency supported by this chip? A: The 71V25761S166BGI can support clock frequencies up to 166 MHz.

  5. Q: What type of interface does this memory chip use? A: The 71V25761S166BGI uses a synchronous interface with burst read and write operations.

  6. Q: Can this memory chip be used in automotive applications? A: Yes, the 71V25761S166BGI is designed to meet automotive industry requirements and can be used in automotive applications.

  7. Q: Does this chip have any built-in error correction capabilities? A: No, the 71V25761S166BGI does not have built-in error correction capabilities. External error correction techniques may need to be implemented if required.

  8. Q: What is the typical access time for this memory chip? A: The typical access time for the 71V25761S166BGI is around 10 ns.

  9. Q: Can this memory chip operate in a wide temperature range? A: Yes, the 71V25761S166BGI is designed to operate in a wide temperature range, typically from -40°C to +85°C.

  10. Q: Is this memory chip available in surface mount packages? A: Yes, the 71V25761S166BGI is available in a surface mount package, specifically the BGA (Ball Grid Array) package.

Please note that the answers provided here are general and may vary depending on the specific datasheet and manufacturer's specifications for the 71V25761S166BGI.