MXSMCGLCE64AE3
Product Overview
- Category: Memory module
- Use: Storage and retrieval of data in electronic devices
- Characteristics: High-speed, reliable, compact form factor
- Package: Small outline dual inline memory module (SODIMM)
- Essence: Provides additional storage capacity for electronic devices
- Packaging/Quantity: Typically sold individually or in multi-packs
Specifications
- Capacity: 64GB
- Type: DDR4 SODIMM
- Speed: 3200MHz
- Voltage: 1.2V
- Form Factor: 260-pin
Detailed Pin Configuration
- Pin 1: VDD
- Pin 2: DQ0
- Pin 3: DQ1
- ...
- Pin 260: VSS
Functional Features
- High-speed data transfer
- Low power consumption
- Plug-and-play installation
- Compatibility with various devices
Advantages
- Increased storage capacity
- Enhanced system performance
- Easy to install and upgrade
- Energy-efficient operation
Disadvantages
- Relatively higher cost compared to lower capacity modules
- Compatibility issues with older devices
Working Principles
The MXSMCGLCE64AE3 operates by storing and retrieving data using the DDR4 SODIMM interface. When installed in a compatible device, it provides additional memory capacity for storing and accessing data.
Detailed Application Field Plans
- Ideal for upgrading laptops and small form factor PCs
- Suitable for use in gaming systems and high-performance workstations
- Compatible with mini PCs and embedded systems for industrial applications
Detailed and Complete Alternative Models
- MXSMCGLCE32AE3: 32GB DDR4 SODIMM
- MXSMCGLCE128AE3: 128GB DDR4 SODIMM
- MXSMCGLCE256AE3: 256GB DDR4 SODIMM
This information provides a comprehensive overview of the MXSMCGLCE64AE3 memory module, including its specifications, features, advantages, and application field plans.
技術ソリューションにおける MXSMCGLCE64AE3 の適用に関連する 10 件の一般的な質問と回答をリストします。
What is MXSMCGLCE64AE3?
- MXSMCGLCE64AE3 is a high-performance, low-power, multi-chip package (MCP) memory solution that combines NAND flash memory and LPDDR4X DRAM in a single package.
What are the key features of MXSMCGLCE64AE3?
- The key features of MXSMCGLCE64AE3 include high data transfer rates, low power consumption, small form factor, and integration of both NAND flash and LPDDR4X DRAM in a single package.
How can MXSMCGLCE64AE3 be used in technical solutions?
- MXSMCGLCE64AE3 can be used in various technical solutions such as mobile devices, automotive applications, industrial IoT, and other embedded systems where high-speed data storage and processing are required.
What are the benefits of using MXSMCGLCE64AE3 in technical solutions?
- The benefits of using MXSMCGLCE64AE3 include reduced board space, simplified design, improved system performance, and lower power consumption compared to separate NAND flash and LPDDR4X DRAM components.
What are the typical applications for MXSMCGLCE64AE3?
- Typical applications for MXSMCGLCE64AE3 include smartphones, tablets, automotive infotainment systems, industrial automation, and edge computing devices.
What are the interface options for MXSMCGLCE64AE3?
- MXSMCGLCE64AE3 supports standard interfaces such as eMMC, UFS, and MIPI for NAND flash, and LPDDR4X DRAM interface for seamless integration into various platforms.
Are there any specific design considerations when using MXSMCGLCE64AE3?
- Designers should consider signal integrity, thermal management, and power delivery to ensure optimal performance and reliability when integrating MXSMCGLCE64AE3 into their designs.
What are the available capacities for MXSMCGLCE64AE3?
- MXSMCGLCE64AE3 is available in various capacities ranging from 16GB to 256GB, providing flexibility for different application requirements.
Does MXSMCGLCE64AE3 support security features?
- MXSMCGLCE64AE3 may support security features such as hardware encryption, secure boot, and secure firmware update capabilities, depending on the specific implementation.
Where can I find more detailed technical information about MXSMCGLCE64AE3?
- Detailed technical information about MXSMCGLCE64AE3 can be found in the product datasheets, application notes, and technical documentation provided by the manufacturer.