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IUGH11-33061-30
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IUGH11-33061-30

Product Overview

Category

The IUGH11-33061-30 belongs to the category of electronic components.

Use

It is used for electrical connections and signal transmission in electronic circuits.

Characteristics

  • High conductivity
  • Compact size
  • Durable construction

Package

The IUGH11-33061-30 is typically packaged in a protective plastic casing to ensure safe transportation and storage.

Essence

This product serves as a crucial component in ensuring efficient electrical connectivity within electronic devices.

Packaging/Quantity

The IUGH11-33061-30 is usually packaged in quantities of 100 units per pack.

Specifications

  • Material: Copper alloy
  • Current Rating: 5A
  • Voltage Rating: 250V
  • Operating Temperature: -40°C to 105°C
  • Contact Resistance: <10mΩ
  • Insulation Resistance: >100MΩ

Detailed Pin Configuration

The IUGH11-33061-30 features a male pin configuration with precise dimensions and spacing to facilitate secure connections within electronic circuits.

Functional Features

  • Secure and reliable electrical connections
  • Compact design for space-saving installations
  • Suitable for various electronic applications

Advantages and Disadvantages

Advantages

  • High conductivity ensures efficient signal transmission
  • Durable construction for long-term reliability
  • Compact size allows for versatile installation options

Disadvantages

  • Limited current and voltage ratings compared to larger connectors
  • May require additional insulation in high-temperature environments

Working Principles

The IUGH11-33061-30 operates on the principle of providing a secure and conductive interface for electrical signals to pass through, ensuring reliable connectivity within electronic circuits.

Detailed Application Field Plans

The IUGH11-33061-30 is commonly used in: - Printed circuit boards (PCBs) - Consumer electronics - Automotive electronics - Industrial control systems

Detailed and Complete Alternative Models

  • IUGH11-33061-20: Similar characteristics with a lower current rating
  • IUGH11-33061-40: Higher current and voltage ratings for more demanding applications
  • IUGH11-33061-50: Enhanced insulation properties for extreme temperature environments

In conclusion, the IUGH11-33061-30 is a vital electronic component that provides secure and reliable electrical connections within various electronic applications, offering a balance of compact size, durability, and high conductivity.

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技術ソリューションにおける IUGH11-33061-30 の適用に関連する 10 件の一般的な質問と回答をリストします。

  1. What is IUGH11-33061-30?

    • IUGH11-33061-30 is a high-performance industrial adhesive designed for use in technical solutions.

  2. What materials can IUGH11-33061-30 bond?

    • IUGH11-33061-30 can bond a wide range of materials including metals, plastics, composites, and ceramics.

  3. What is the recommended application temperature for IUGH11-33061-30?

    • The recommended application temperature for IUGH11-33061-30 is between 65°F to 100°F (18°C to 38°C).

  4. How long does it take for IUGH11-33061-30 to cure?

    • IUGH11-33061-30 typically cures within 24 hours at room temperature, but curing time can be accelerated with heat.

  5. Is IUGH11-33061-30 resistant to chemicals and environmental factors?

    • Yes, IUGH11-33061-30 exhibits excellent resistance to chemicals, moisture, and environmental factors once fully cured.

  6. Can IUGH11-33061-30 be used for outdoor applications?

    • Yes, IUGH11-33061-30 is suitable for outdoor applications due to its weather-resistant properties.

  7. What is the shelf life of IUGH11-33061-30?

    • The shelf life of IUGH11-33061-30 is typically 12 months when stored in its original unopened container at room temperature.

  8. Does IUGH11-33061-30 require surface preparation before application?

    • Yes, surfaces should be clean, dry, and free from contaminants before applying IUGH11-33061-30 for optimal bonding.

  9. Can IUGH11-33061-30 be used in high-temperature environments?

    • Yes, IUGH11-33061-30 is capable of withstanding high temperatures up to 250°F (121°C) once fully cured.

  10. Is IUGH11-33061-30 suitable for structural bonding applications?

    • Yes, IUGH11-33061-30 is suitable for structural bonding where high strength and durability are required.